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BGS13GA14 sp3t diversity antenna switch with gpio interface data sheet revision 3.0 - 2016-02-11
edition 2016-02-11 published by in?neon technologies ag 81726 munich, germany c 2016 in?neon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, in?neon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest in?neon technologies of?ce ( www.in?neon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest in?neon technologies of?ce. in?neon technologies components may be used in life-support devices or systems only with the express written approval of in?neon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGS13GA14 revision history document no.: BGS13GA14__v3.0.pdf revision history: rev. v3.0 previous version: 2.0 page subjects (major changes since last revision) 5 maximum frequency changed to 6 ghz 8 il, rl, and iso performance added for frequency range 5 ghz to 6 ghz in table 6 12 carrier tape drawing updated in figure 6 trademarks of in?neon technologies ag hvic tm , ipm tm , pfc tm , au-convertir tm , aurix tm , c166 tm , canpak tm , cipos tm , cipurse tm , cooldp tm , coolgan tm , coolir tm , coolmos tm , coolset tm , coolsic tm , dave tm , di-pol tm , directfet tm , drblade tm , easypim tm , econobridge tm , econodual tm , econopack tm , econopim tm , eicedriver tm , eupec tm , fcos tm , ganpowir tm , hexfet tm , hitfet tm , hybridpack tm , imotion tm , iram tm , isoface tm , isopack tm , ledrivir tm , litix tm , mipaq tm , modstack tm , my-d tm , novalithic tm , optiga tm , optimos tm , origa tm , powiraudio tm , powirstage tm , primepack tm , primestack tm , profet tm , pro-sil tm , rasic tm , real3 tm , smartlewis tm , solid flash tm , spoc tm , strongirfet tm , supirbuck tm , tempfet tm , trenchstop tm , tricore tm , uhvic tm , xhp tm , xmc tm . other trademarks all referenced product or service names and trademarks are the property of their respective owners. trademarks updated november 2015 data sheet 3 revision 3.0 - 2016-02-11
BGS13GA14 contents contents 1 features 5 2 product description 5 3 maximum ratings 6 4 operation ranges 7 5 rf characteristics 8 6 gpio speci?cation 9 7 package related information 10 list of figures 1 BGS13GA14 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 footprint, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 package outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 land pattern drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 laser marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 list of tables 1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 maximum ratings, table i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 maximum ratings, table ii . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 operation ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 rf input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 rf characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 switching time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 imd2 testcases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 imd3 testcases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 gpio truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 pin de?nition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 data sheet 4 revision 3.0 - 2016-02-11
BGS13GA14 BGS13GA14 1 features 3 high-linearity, interchangeable rx ports low insertion loss low harmonic generation high port-to-port-isolation suitable for edge / c2k / lte / wcdma applications 0.1 to 6.0 ghz coverage no decoupling capacitors required if no dc applied on rf lines on chip control logic including esd protection general purpose input-output (gpio) interface small form factor 2.0 mm x 2.0 mm no power supply blocking required high emi robustness rohs and weee compliant package 2 product description the BGS13GA14 is a single pole three throw (sp3t) diversity switch optimized for wireless applications up to 6.0 ghz. it is part of sp3t-sp8t diversity switch family designed to meet the requirements of chipset reference designs. the module comes in a miniature atslp package and comprises of a cmos sp3t switch with integrated gpio interface. this rf switch is a perfect solution for multimode handsets based on lte and wcdma. the switch device con?guration is shown in fig. 1 . the switch is controlled via a gpio interface. it features dc-free rf ports and unlike gaas technology, external dc blocking capacitors at the rf ports are only required if dc voltage is applied externally. table 1: ordering information type package marking BGS13GA14 atslp-14 g3 data sheet 5 revision 3.0 - 2016-02-11
BGS13GA14 figure 1: BGS13GA14 block diagram 3 maximum ratings table 2: maximum ratings, table i at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. frequency range f 0.1 C C ghz 1) supply voltage v dd -0.5 C 3.6 v C storage temperature range t stg -55 C 150 c C junction temperature t j C C 125 c C rf input power at all rx ports p rf _ rx C C 32 dbm cw esd capability, cdm 2) v esd cdm 500 C +500 v all pins esd capability, hbm 3) v esd hbm 1 C +1 kv digital, digital versus rf 1 C +1 v rf esd capability, system level 4) v esd ant 8 C +8 kv ant versus system gnd, with 27 nh shunt inductor 1) there is also a dc connection between switched paths. the dc voltage at rf ports v rfdc has to be 0v. 2) field-induced charged-device model jesd22-c101. simulates charging/discharging events that occur in production equipment and processes. potential for cdm esd events occurs whenever there is metal-to-metal contact in manufacturing. 3) human body model ansi/esda/jedec js-001-2012 ( r = 1.5 k
, c = 100 pf). 4) iec 61000-4-2 ( r = 330
, c = 150 pf), contact discharge. data sheet 6 revision 3.0 - 2016-02-11
BGS13GA14 table 3: maximum ratings, table ii at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. thermal resistance junction - solder- ing point r thjs C 60 C k/w C maximum dc-voltage on rf-ports and rf-ground v rfdc 0 C 0 v no dc voltages allowed on rf-ports gpio control voltage levels v ctrlx -0.7 C v dd +0.7 v C 4 operation ranges table 4: operation ranges parameter symbol values unit note / test condition min. typ. max. supply voltage v dd 2.4 3.0 3.4 v C supply current i dd C 75 200 a C gpio control voltage high v ctrl _ h 1.35 C v dd v C gpio control voltage low v ctrl _ l 0 C 0.45 v C gpio control input capaci- tance c ctrl C C 2 pf C ambient temperature t a -30 25 85 c C table 5: rf input power parameter symbol values unit note / test condition min. typ. max. rx ports (50
) p rf _ rx C C 28 dbm C data sheet 7 revision 3.0 - 2016-02-11
BGS13GA14 5 rf characteristics table 6: rf characteristics at t a = 30 c...85 c, p in = 0 dbm, supply voltage v dd = 2.4 v...3.4 v, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. insertion loss 1) all rx ports il C 0.30 0.45 db 698C960 mhz C 0.40 0.55 db 1428C1990 mhz C 0.40 0.55 db 1920C2170 mhz C 0.45 0.60 db 2170C2690 mhz C 0.55 0.70 db 3400C3600 mhz C 0.55 0.70 db 3600C3800 mhz C 0.65 0.75 db 5000C6000 mhz return loss 1) all rx ports rl 19 22 C db 698C960 mhz 17 20 C db 1428C1990 mhz 16 19 C db 1920C2170 mhz 15 18 C db 2170C2690 mhz 14 16 C db 3400C3600 mhz 13 15 C db 3600C3800 mhz 13 15 C db 5000C6000 mhz isolation 1) all rx ports iso 32 45 C db 698C960 mhz 25 42 C db 1428C1990 mhz 24 40 C db 1920C2170 mhz 23 38 C db 2170C2690 mhz 20 35 C db 3400C3600 mhz 19 33 C db 3600C3800 mhz 18 27 C db 5000C6000 mhz harmonic generation (umts band 1, band 5) 1) 2 nd harmonic generation p h 2 90 100 C dbc 25 dbm, 50
, cw mode 3 rd harmonic generation p h 3 80 90 C dbc 25 dbm, 50
, cw mode intermodulation distortion (umts band 1, band 5) 1) 2 nd order intermodulation imd2 low C -105 -100 dbm imt, us cell (see tab. 8 ) 3 rd order intermodulation imd3 C -110 -105 dbm imt, us cell (see tab. 9 ) 2 nd order intermodulation imd2 high C -115 -110 dbm imt, us cell (see tab. 8 ) 1) on application board without any matching components. data sheet 8 revision 3.0 - 2016-02-11
BGS13GA14 table 7: switching time at t a = 25 c, p in = 0 dbm, supply voltage v dd = 2.4 vC3.4 v, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. switching time rf rise time t rt C C 2 s 10 % to 90 % rf signal switching time t st C 2 4 s 50 % ctrl signal to 90 % rf signal power up settling time t pup C 10 25 s after power down mode table 8: imd2 testcases band cw tone 1 (mhz) cw tone 1 (dbm) cw tone 2 (mhz) cw tone 2 (dbm) imt 1950 20 190 (imd2 low) -15 4090 (imd2 high) us cell 835 20 45 (imd2 low) -15 1715 (imd2 high) table 9: imd3 testcases band cw tone 1 (mhz) cw tone 1 (dbm) cw tone 2 (mhz) cw tone 2 (dbm) imt 1950 20 1760 -15 us cell 835 20 790 -15 6 gpio speci?cation table 10: modes of operation (truth table) control inputs state mode v1 v2 v3 1 rx1-ant 0 0 0 2 rx2-ant 0 0 1 3 rx3-ant 0 1 0 4 isolation 0 1 1 5 isolation 1 0 0 6 50
1 0 1 7 isolation 1 1 0 8 shutdown 1 1 1 data sheet 9 revision 3.0 - 2016-02-11
BGS13GA14 7 package related information the switch has a package size of 2000 m in x-dimension and 2000 m in y-dimension with a maximum deviation of 50 m in each dimension. fig. 2 shows the footprint from top view. the de?nition of each pin can be found in tab. 12 . in addition a recommendation for the land pattern is displayed in fig. 4 followed by information regarding laser marking (see fig. 5 ). table 11: mechanical data parameter symbol value unit package x-dimension x 2000 50 m package y-dimension y 2000 50 m package height h 0.65 max m figure 2: footprint, top view table 12: pin de?nition no. name pin type function 0 gnd gnd rf ground; die pad 1 nc not connected 2 rx3 i/o rx port 3 3 rx1 i/o rx port 1 4 vdd pwr v dd supply 5 v3 i gpio control pin 6 v2 i gpio control pin 7 v1 i gpio control pin 8 nc not connected 9 rx2 i/o rx port 2 10 nc not connected 11 nc not connected 12 nc not connected 13 ant i/o antenna port 14 nc not connected data sheet 10 revision 3.0 - 2016-02-11 1 2 3 4 1 1 1 0 9 8 1 4 1 2 1 3 5 7 6 t o p v i e w n c a n t n c v 3 v 2 v 1 v d d r x 1 r x 3 n c n c r x 2 n c n c
BGS13GA14 figure 3: package outline drawing figure 4: land pattern drawing data sheet 11 revision 3.0 - 2016-02-11 8 9 10 11 1 3 2 4 0.02 max. 0.6 pin 1 marking top view bottom view 14 13 12 5 6 7 standoff 0.45 3 x 0.45 = 1.35 1.69 1.69 2 0.05 0.05 a 0.4 2 x 0.4 = 0.8 2 0.05 0.2 6x 0.05 b 0.1 b 0.05 1 0.1 b 0.2 8x 0.05 0.1 a 0.18 6x 0.05 0.1 a 0.18 8x 0.05 0.1 b 1 0.05 0.1 a
BGS13GA14 figure 5: laser marking figure 6: carrier tape data sheet 12 revision 3.0 - 2016-02-11
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